TATE offers the latest “New Generation” MSP (multiple solder preservative) finish which is highly resistant to multiple thermal treatments. It will provide excellent solderability and is compatible with all no-clean fluxes and lead-free solders.
The maximum process temperature is 50 deg C; this will ensure perfectly flat warp-free boards and flat copper surfaces, essential for the automatic assembly of fine pitch components. The process is fully automated.
Key Features
- Conforms to lead-free regulations
- Excellent solderability
- Excellent shelf life
- Multiple heat pass
- Flat surface area
- Warped/bowed panels eliminated
- Improved final inspection
Application Method
The MSP application is by a fully automated inline conveyor flood coat system. The process is laboratory controlled and environmentally friendly. The organic solder preservative will only “bond or adhere” to bare copper surfaces, ensuring no migration on to other unwanted areas of the board. At the start of the process all panels are subject to a rigorous cleaning process to ensure a clean copper area, the boards are then rinsed at high pressure and fully dried before the MSP is applied in a food chamber. Following this process, further rinse and drying stages complete the application.
TATE installed new fully automated Immersion Silver processing equipment and a comprehensive fresh de-ionised water plant to offer customers an excellent metallic lead-free finish. The Immersion Silver finish offers excellent solderability with leaded and lead-free solders.
The maximum process temperature is 50 deg C; this will ensure perfectly flat warp-free boards and flat copper surfaces, essential for the automatic assembly of fine pitch components.
Key Features
- Conforms to lead-free regulations
- Excellent solderability
- Excellent shelf life
- Multiple heat pass
- Flat surface area
- Warped/bowed panels eliminated
- Metallic finish
Application method
The Immersion Silver is processed in a fully automated inline flood coat system. The process is laboratory controlled and operates at a maximum temperature of 50 deg C. at the start of the process all panels are subject to a rigorous cleaning process to ensure a clean copper area, the boards are then rinsed at high pressure and fully dried prior to immersion in the silver flood chamber. A two stage final rinse and drying cycle completes the process. The key to producing the silver finish is the constant supply of fresh de-ionised water to all the rinse stations during processing. The dedicated water treatment plant feeds fresh high quality water through the process then constantly recycles the used rinse water.
We are pleased to announce a new addition to our range of in-house services with the installation of an Immersion Gold line at our production facility. The arrival of this finish will ensure we can give our customers the widest possible choice of RoHS compliant PCB finishes in-house.
Since the introduction of the RoHS legislation in 2006, Immersion Gold has become favoured by many manufacturers and sub-contract assembly companies, particularly where higher value technology circuit boards are required. This finish has the added advantage, as with MSP and Immersion Silver, of an extremely flat surface area which is critical for the accurate placement of fine pitch surface mount devices. It also has excellent shelf life and re-working properties, able to withstand multiple thermal cycles during assembly processes.
Key Features